EU updates RoHS exemption annex

Lead in high-melting temperature type solders has been changed from tin-lead solder alloys containing more than 85 % lead to lead-based alloys containing 85 % by weight or more lead. Cadmium and its compounds in electrical contacts have been added to the cadmium plating exemption .

Several other exemptions (11 through 15) have been added to the annex list. These include the following:

11. Lead used in compliant pin connector systems

12. Lead as a coating material for the thermal conduction module c-ring

13. Lead and cadmium in optical and filter glass

14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight

15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages. Click here for the European Union (EU) document.

Earlier in October, the EU made the decision to exempt decabromodiphenyl ether (Deca-BDE) from the RoHS directive. Click here for more information.

Editor's note: Here are a couple of follow-up articles.
March 2006: Five RoHS exemptions are one step closer to approval

July 2006: Six new exemptions pass TAC vote