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Irvine, Calif. — Henkel will launch several new lead-free products and display its entire semiconductor packaging and printed-circuit-board (PCB) assembly product line including the Multicore brand at APEX 2007 in Los Angeles.
One key product on display will be Henkel's Multicore LF328, a low-voiding, lead-free solder paste formulation. This solder paste is said to reduce voids by as much as 50 percent, while delivering long open and abandon times, a wide process window and a halide-free, no-clean material that can handle high-volume stencil printing for CSP lead pitches of 0.4 mm.
Henkel will also display its Multicore MFR301 lead-free flux system that is compatible with lead-free and traditional tin-lead wave soldering processes, and its new Loctite 3536 lead-free underfill system that was developed for CSP and BGA packages. Testing of the material to JEDEC drop test standards on 0.4-mm and 0.5-mm lead-free devices has shown that Loctite 3536 offers five times the reliability over non-underfilled lead-free devices, said the company.
Loctite 3536 is a high flow, lead-free compatible underfill that cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing to increase device throughput, said the company.
Loctite 3536 is also said to deliver superior protection for solder joints against mechanical strains such as shock, drop and vibration. The material also delivers exceptional manufacturing flexibility since it is compatible with lead-free solder materials to allow for an increased process window and is reworkable, enabling the recovery of expensive substrates and PCBs.
Henkel, 1-949-789-2500, www.henkelelectronics.com/electronics
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